Used Semiconductor Equipment

Disk Inspection Microscope/Motorized Stage Microscope Type Upright Microscope Configuration Brightfield, DIC Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Microscope Configuration Brightfield & Darkfield Illumination Type Reflected Light Binocular Angle Variable Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Microscope Configuration Brightfield, Darkfield & DIC Illumination Type Hg Reflected Light Binocular Angle Location : AMERICA North (USA-Canada-Mexico)

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CVD: APCVD/6in Location : ASIA (North East)

Price : On request

Ion implanter Model E220 Year(s) : 1995 Location : ASIA (North East)

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Wet Oxide Etcher Location : ASIA (North East)

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Lithography Coater and Developer Version: 300 mm Location : AMERICA North (USA-Canada-Mexico)

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Metal film measurement system Version: 150-200 mm Vintage: 01.06.2006 The equipment has been professionally de Year(s) : 2006 Location : AMERICA North (USA-Canada-Mexico)

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Refurbished condition Sold in good working condition Year(s) : 2000 Location : EUROPE (Western and Northern)

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Main Axis is not operational. Year(s) : 1999 Location : EUROPE (Western and Northern)

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Wafer size: 8" Condition: as is - Load/Unload: Dual SMIF Arm with Wafer Transfer System (LRL process flow) - M Year(s) : 2001 Location : EUROPE (Western and Northern)

Price : On request

Spectroscopic ellipsometry: Measures the change in polarization state of light reflected from a sample to de Location : AMERICA North (USA-Canada-Mexico)

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The Model DE3496 provides particle concentrations per in.2 or cm2 in five sizes from 0.3 µm to 10 µm. It mea Location : AMERICA North (USA-Canada-Mexico)

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Bare Wafer Surface Defect Inspection System Max Wafer Capable: 8”/200mm System configured for 8“/200mm wafers Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Horizontal spin axis, for up to 6″ wafers Location : AMERICA North (USA-Canada-Mexico)

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20 HEAVY WIRE BONDER FOR 10-20 MIL WIRE INCLUDES CALIBRATED STEREO ZOOM OPTICS (ADD $740 FOR DEEP ACCESS CLAMP Location : AMERICA North (USA-Canada-Mexico)

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7400B Wedge bonder for deep access Location : AMERICA North (USA-Canada-Mexico)

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Digital Microscope Model Number: VHX-5000 • Controller Unit: VHX-5000 • Camera Unit: VHX-5020 • RZ Lens: VH-Z2 Location : AMERICA North (USA-Canada-Mexico)

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Die Shear Bond Tester Location : AMERICA North (USA-Canada-Mexico)

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【specification】 Marking method: XYZ3-axis simultaneous scanning method Mark Laser: YVO4 laser (class 4) Wave l Year(s) : 2017 Location : ASIA (North East)

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【specification】 Seal Character Direction Type: XYZ3-axis simultaneous scanning method Seal Character: YVO4 Las Year(s) : 2014 Location : ASIA (North East)

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Condition Good Exterior Dimensions Width 86.614 in (220.0 cm) Depth 49.213 in (125.0 cm) Height Year(s) : 2016 Location : EUROPE (Western and Northern)

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Wafer Size Range Minimum 150 mm Maximum 200 mm Number of Cassette Elevators 2 Wafer Handling Random Year(s) : 1998 Location : EUROPE (Western and Northern)

Price : On request

Bare Wafer Surface Defect Inspection System The Surfscan 6400 is a highly advanced inspection system desig Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Surface Inspection System Location : AMERICA North (USA-Canada-Mexico)

Price : On request